Used Lab Equipment

Primary Applications • Histology • DIC microscopy • Immunofluorescence • FISH • Fixed-cell GFP imaging • High-resolution time-lapse microscopy Features • 20-MHz readout Fast image readout for high-speed focus and image capture • 1392 x 1040 imaging array • 4.65 x 4.65-μm pixels • Interline-transfer, progressive-scan CCD Full resolution in every frame • Flexible binning and readout Increases light sensitivity while increasing the frame rate • 12-bit digitization Quantifies bright and dim signals in the same image • Thermoelectric cooling Increases integration times for higher sensitivity • C-mount Easily attaches to microscopes, standard lenses, or optical equipment • Subcompact, fanless design Low profile allows easy setup • Acquisition software Captures, analyzes, and saves high-resolution images • PCI interface High-bandwidth, uninterrupted data transfer with no dropped frames • PVCAM • Precise integration with shutters, filter wheels, etc. • Compatible with Windows® XP/Vista 32, Mac OS X, and Linux® (kernel versions 2.4 and 2.6.8)

Description:

• Histology
• DIC microscopy
• Immunofluorescence
• FISH
• Fixed-cell GFP imaging
• High-resolution time-lapse microscopy

Features:

• 20-MHz readout Fast image readout for high-speed focus and image capture
• 1392 x 1040 imaging array
• 4.65 x 4.65-μm pixels
• Interline-transfer, progressive-scan CCD Full resolution in every frame
• Flexible binning and readout Increases light sensitivity while increasing the frame rate
• 12-bit digitization Quantifies bright and dim signals in the same image
• Thermoelectric cooling Increases integration times for higher sensitivity
• C-mount Easily attaches to microscopes, standard lenses, or optical equipment
• Subcompact, fanless design Low profile allows easy setup
• Acquisition software Captures, analyzes, and saves high-resolution images
• PCI interface High-bandwidth, uninterrupted data transfer with no dropped frames
• PVCAM
• Precise integration with shutters, filter wheels, etc.
• Compatible with Windows XP/Vista 32, Mac OS X, and Linux (kernel versions 2.4 and 2.6.8)

Includes Computer loaded w/ software

The Photometrics CoolSNAP HQ Monochrome camera is a fast, high-resolution digital camera system designed for low-light scientific and industrial applications. This cooled CCD camera system provides 12-bit digitization at both 10 MHz and 20 MHz. The fine pitch of the pixels, 6.45 x 6.45 microns, is ideally matched to the resolution of optical microscopes. Megapixel resolution and small pixels allow imagingof very fine detail, yet the pixels can be easily binned to improve sensitivity. New interline CCD technology provides high quantum efficiency, most notably in the near-infrared (NIR) portion of the spectrum.

Specifications:

• CCD image sensor: Sony ICX285; progressive-scan CCD
• CCD format
  • 1392 x 1040 imaging pixels;
  • 45 x 6.45-μm pixels;
  • 77 x 6.6-mm imaging area (optically centered)
• Linear full well
  • 15,000 e- (single pixel);
  • 30,000 e-(2x2 binned pixel)
• Read noise
  • 6 e- rms @ 10 MHz
  • 8 e- rms @ 20 MHz
• Nonlinearity: <1%
• Readout bits/speed: 12 bits @ 20 MHz or 10 MHz; software selectable
• Frame readout: 100 ms/frame
• CCD temperature: -30 ÌŠC regulated
• Video output: RS170/PAL selectable
• Dark current: 0.05 e-/p/s (-30 ÌŠC)
• Operating environment: 0 to 30 ÌŠC ambient, 0 to 80% relative humidity noncondensing

CoolSnap K4 Features: 

 

• 20-MHz readout: High-speed, high-sensitivity image capture
• 2048 x 2048 imaging array: Resolves fine detail
• 7.4 x 7.4-ìm pixels: Ideally matched to optical microscope
• Interline-transfer, progressive-scan CCD: Eliminates camera vibration and facilitates fast triggering
• Flexible binning and readout: Increases light sensitivity while increasing the frame rate
• 12-bit digitization: Quantifies bright and dim signals in the same image
• Thermoelectric cooling: Long integration times for higher sensitivity
• Enhanced quantum efficiency: Provides higher sensitivity than typical interline cameras
• C-mount: Easily attaches to microscopes, standard lenses, or optical equipment
• Acquisition software: Captures, analyzes, and saves high-resolution images
• PCI interface: High-bandwidth, uninterrupted data transfer
• PVCam, Circular buffers, Device sequencing: Supported by numerous third-party software packages, Real-time focus, Precise integration with shutters, filter wheels, etc. (Compatible with Windows XP/Vista 32, Mac OS X, and Linux (kernel versions 2.4 and 2.6.8))
• CCD image sensor: Kodak KAI-4020M; interline-transfer, progressive-scan device with microlenses
• CCD format: 2048 x 2048 imaging array, 7.4 x 7.4-um pixels, 15.16 x 15.16-mm imaging area (optically centered)
• Linear full well: 30,000 e- (single pixel); 60,000 e- (2 x 2 binned pixel)
• Read noise: ≤10 e- rms @ 20 MHz
• Nonlinearity: <1%
• Digitizer type: 12 bits @ 20 MHz
• CCD temperature: -25ͦC (regulated)
• Dark current : 0.1 e-/p/s @ -25ͦC
• Operating environment: 0 to 30ͦC ambient, 0 to 80% relative humidity noncondensing
• I/O TTL (trigger/status): trigger, invert, inhibit, exposing, interline shift, frame readout, 8-bit TTL (programmable), 8-bit DACs(two)

Includes Computer Loaded w/ Software

 

High-resolution, quick-and-easy image capture and retrieval. The DXM1200 utilizes Nikon's new IPS (Inter Pixel Stepping) high density imaging technology to produce true-to-life, extremely high quality images with up to approximately 12 million (3840 x 3072) output pixels.

 

Key Features

• Digital Circuit Technology: High signal-to-noise (S/N) digital circuit technology allows image capture with exceptionally high sensitivity. Even clear imaging of fluorescence specimens is possible due to the low noise design combined with three levels of sensitivity and long integration times of up to 170 seconds.
• High Speed Data Transfer: High Speed data transfer to computer at 12 frames/second for easy on-screen focusing. ACT-1 (Automatic Camera Tamer) intuitive software enhances the photomicrographic process and allows on screen ergonomic viewing of a live image, last stored image and thumbnails of the last five images saved.

 

Specifications:

• Image size/Resolution level:
  • 3,840 (H) x 3,072 (V) pixels
  • (max. in Fine mode); 1,280 (H) x 1,204 (V) pixels
  • (max. in Quick mode): CCD: 2/3 in. high density CCD;
  • total number of pixels: 1.4 million (effective 1.34 million)
• Lens mount: C mount
• Sensitivity setting: 3 levels selectable: Normal, High and Max.
• Exposure control: Manual
• Auto white balance: Can be preset by selecting a point or rectangle
• Exposure time: 1/12,000 to 170 sec.
• Shooting mode:
  • Fine (10 types): 3,840 x 3,072 pixels to 640 x 480 pixels
  • Quick (4 types): 1,280 x 1,024 pixels to 640 x 480 pixels
• Live image size: 640 x 512 pixels (12 frames/sec. max.)
• Data saving format: BMP, JPEG (3 types compression), or TIF
• (uncompressed)
• Interface: Dedicated interface board (PCI bus)
• Dimensions: 78 (W) x 136 (H) x 69 (D) mm (3.1 x 5.4x 2.7 in.) excluding protrusions;Interface cable: approx. 2m (6.6 ft.)
• Weight (without battery): 800g (28.3 oz.) excluding lens
• Operating temperature/ Temperature: 0 to +40?C, Humidity: 10 to
• Power supply: Supplied from PCI bus (via dedicated PCI board)
• IPS (Inter Pixel Stepping) Sensor: takes 9 frames offset by 2/3 pixel

Includes Computer Loaded w/ Software

Thanks to Nikon-original low-noise design and a new CCD with a sensitivity more than twice that of conventional models, the DXM1200F can capture fluorescence images with excellent clarity and in high contrast.

 

High-resolution, quick-and-easy image capture and retrieval. The DXM1200 utilizes Nikon's new IPS (Inter Pixel Stepping) high density imaging technology to produce true-to-life, extremely high quality images with up to approximately 12 million (3840 x 3072) output pixels.

 

Key Features

• Digital Circuit Technology: High signal-to-noise (S/N) digital circuit technology allows image capture with exceptionally high sensitivity. Even clear imaging of fluorescence specimens is possible due to the low noise design combined with three levels of sensitivity and long integration times of up to 170 seconds.
• High Speed Data Transfer: High Speed data transfer to computer at 12 frames/second for easy on-screen focusing. ACT-1 (Automatic Camera Tamer) intuitive software enhances the photomicrographic process and allows on screen ergonomic viewing of a live image, last stored image and thumbnails of the last five images saved.

 

Specifications:

• Image size/Resolution level:
  • 3,840 (H) x 3,072 (V) pixels
  • (max. in Fine mode); 1,280 (H) x 1,204 (V) pixels
  • (max. in Quick mode): CCD: 2/3 in. high density CCD;
  • total number of pixels: 1.4 million (effective 1.34 million)
• Lens mount: C mount
• Sensitivity setting: 3 levels selectable: Normal, High and Max.
• Exposure control: Manual
• Auto white balance: Can be preset by selecting a point or rectangle
• Exposure time: 1/12,000 to 170 sec.
• Shooting mode:
  • Fine (10 types): 3,840 x 3,072 pixels to 640 x 480 pixels
  • Quick (4 types): 1,280 x 1,024 pixels to 640 x 480 pixels
• Live image size: 640 x 512 pixels (12 frames/sec. max.)
• Data saving format: BMP, JPEG (3 types compression), or TIF
• (uncompressed)
• Interface: Dedicated interface board (PCI bus)
• Dimensions: 78 (W) x 136 (H) x 69 (D) mm (3.1 x 5.4x 2.7 in.) excluding protrusions;Interface cable: approx. 2m (6.6 ft.)
• Weight (without battery): 800g (28.3 oz.) excluding lens
• Operating temperature/ Temperature: 0 to +40?C, Humidity: 10 to
• Power supply: Supplied from PCI bus (via dedicated PCI board)
• IPS (Inter Pixel Stepping) Sensor: takes 9 frames offset by 2/3 pixel

Andor’s iKon-M 934 series cameras are designed to offer the ultimate in high-sensitivity, low noise performance, ideal for demanding imaging applications. These high resolution 1024 x 1024 CCD cameras boast up to 95% QEmax, high dynamic range, 13 μm pixels and exceptionally low readout noise. The iKon-M benefits from negligible dark current with industry-leading thermoelectric cooling down to -100°C. The ‘Deep Depletion’ sensor option offers ultimate performance for NIR applications, the new Dual AR coating extends the QE performance significantly across the UV/visible region of the spectrum for the broadest possible spectral coverage from one sensor. Fringe Suppression Technology radically minimizes etaloning effects in the NIR. Rapid vertical shifts combined with fast kinetics acquisition mode, comprehensive trigger modes and custom coated wedge window options, render the deep Depletion models ideal for NIR

optimized Bose Einstein Condensation applications.

 

Features and Benefits:

• Extended range Dual-AR option: Superior UV-NIR broadband back-illuminated QE
• TE cooling to -100°C: Critical for elimination of dark current
• Fringe Suppression Technology: NIR etaloning greatly reduced (BR-DD and BEX2-DD sensor types)
• Up to 5 MHz pixel readout: High frame rates achievable
• Ultra low noise readout: Intelligent low-noise electronics offer the most ‘silent’ system noise performance available
• UltraVac: Critical for sustained vacuum integrity and to maintain unequalled cooling and QE performance, year after year
• 13 x 13 μm pixel size: Optimal balance of dynamic range and resolution
• Integrated shutter: C-mount shutter as standard. Closed during readout to avoid vertical smear
• Cropped Sensor Mode: Specialized acquisition mode for continuous imaging with fastest possible temporal resolution
• Enhanced Baseline Clamp: Quantitative accuracy of dynamic measurements
• USB 2.0 connection: Simple Plug & Play connection
• Integrated in EPICS: Platform is fully integrated into the EPICS control software

 

Specifications:

• Active pixels: 1024 x 1024
• Sensor size: 13.3 x 13.3 mm
• Pixel size (W x H): 13 μm x 13 μm
• Active area pixel well depth: 100,000 e- (130,000 e- for BR-DD and BEX2-DD models)
• Pixel readout rates (MHz): 5, 3, 1, 0.05
• Read noise: 2.9 e-
• Maximum cooling: -100°C
• Frame rate: 4.4 fps (full frame)
• System window type: UV-grade fused silica, ‘Broadband VUV-NIR’, wedged
• Interface: USB 2.0

The highly innovative iXon Ultra 888 megapixel, back-illuminated EMCCD camera offers single photon sensitivity across a large field of view, at 26 fps. Building on a rich history of first to market innovation, the ‘supercharged’ iXon Ultra 888, represents a massive performance boost for the largest available EMCCD sensor, as well as the first USB 3.0 enabled EMCCD camera.

Specifications:

• Active pixels (H x V): 1024 x 1024
• Pixel size (W x H; μm ): 13 x 13
• Image area (mm): 13.3 x 13.3
• Active Area Pixel Well Depth (e-): 80,000
• Max Readout Rate (MHz): 30
• Frame rates (fps): 26 (full frame) - 9690
• Read noise (e-): <1 with EM gain
• QE Max: >95%
• Sensor QE options: #BV: Back Illuminated, standard AR coated
  

The highly innovative iXon Ultra 888 megapixel, back-illuminated EMCCD camera offers single photon sensitivity across a large field of view, at 26 fps. Building on a rich history of first to market innovation, the ‘supercharged’ iXon Ultra 888, represents a massive performance boost for the largest available EMCCD sensor, as well as the first USB 3.0 enabled EMCCD camera.

 

Specifications:

• Active pixels (H x V): 1024 x 1024
• Pixel size (W x H; μm ): 13 x 13
• Image area (mm): 13.3 x 13.3
• Active Area Pixel Well Depth (e-): 80,000
• Max Readout Rate (MHz): 30
• Frame rates (fps): 26 (full frame) - 9690
• Read noise (e-): <1 with EM gain
• QE Max: >95%
• Sensor QE options: UVB: Back Illuminated, standard AR with additional lumogen coating
  

The iXon Ultra 897 platform takes the popular back-illuminated 512 x 512 frame transfer sensor and overclocks readout to 17 MHz, pushing speed performance to an outstanding 56 fps (full frame), whilst maintaining single photon sensitivity and quantitative stability throughout. New Optically Centred Crop Mode unlocks unparalleled frame rate performance from centrally located ROIs, ideal for the particular speed and sensitivity requirements of super-resolution microscopy.

Specifications: 

• Active pixels (H x V): 512 x 512
• Pixel size (W x H; μm ): 16 x 16
• Image area (mm): 8.2 x 8.2
• Active Area Pixel Well Depth (e-): 180,000
• Max Readout Rate (MHz): 17
• Frame rates (fps): 56 (full frame) - 11,074
• Read noise (e-): <1 with EM gain
• QE Max: >95%
• Sensor QE options: EXF: Back illuminated, dual AR coated with fringe suppression
  
  

Andor’s new iXon Life EMCCD (Electron Multiplying CCD) platform is available exclusively for fluorescence microscopy applications and is engineered to deliver single photon sensitivity with absolutely unparalleled price/performance. The ideal detector to drive superlative performance from confocal spinning disk technology. Whilst affording superb confocality and low rates of phototoxicity, spinning disk experiments are inherently photon starved, by virtue of the photon rejection implicit to optical sectioning. The superior sensitivity of the iXon Life detector brings these low light images to life.

Specifications:

• Sensor Type: Back Illuminated, standard AR coated
• Active pixels (H x V): 1024 x 1024
• Pixel Size (H x V: µm): 13 x 13
• Image Area: 13.3 x 13.3 mm with 100% Fill Factor
• Active Area Pixel Well Depth (e-): 80,000 180,000
• Pixel Readout Rate
• Minimum Temperature, air cooled, ambient 20°C: 10 MHz -70ºC, 30 MHz•3 -55ºC
• Chiller Liquid Cooling, coolant @ 10°C, >0.75l/min: 10 MHz -80ºC, 30 MHz•3 -65ºC
• Thermostatic Precision: ± 0.01°C
• Triggering: Internal, External, External Start, External Exposure, Software Trigger
• System Window Type: UV-grade fused silica, Broadband Visible-Near Infrared, 0.5 degree wedge
• Digitization: 16-bit (at all speeds)
• PC Interface: USB 3.0•12
• Lens Mount: C-mount
• Dark Current and Background Events•4,5:
• Dark Current (e- /pixel/sec) @ -80°C: 0.00025
• Spurious Background (events/pix) @ 1000x gain / -80°C: 0.005
• Active Area Pixel Well Depth: 80,000 e-
• Gain Register Pixel Well Depth•6: 730,000 e-
• Read noise (e-) •7: <1
• Linearity•8: Better than 99.9%
• Vertical Clock Speed: 0.6 to 4.33 µs (user selectable)
• Timestamp accuracy: 10 ns

 

 

 

 

 

Andor’s new iXon Life EMCCD (Electron Multiplying CCD) platform is available exclusively for fluorescence microscopy applications and is engineered to deliver single photon sensitivity with absolutely unparalleled price/performance. The ideal detector to drive superlative performance from confocal spinning disk technology. Whilst affording superb confocality and low rates of phototoxicity, spinning disk experiments are inherently photon starved, by virtue of the photon rejection implicit to optical sectioning. The superior sensitivity of the iXon Life detector brings these low light images to life.

Specifications:

• Sensor Type: Back Illuminated, standard AR coated
• Active pixels (H x V): 512 x 512
• Pixel Size (H x V: µm): 16 x 16 μm
• Image Area: 8.2 x 8.2 mm with 100% Fill Factor
• Active Area Pixel Well Depth (e-): 80,000 180,000
• Pixel Readout Rate
• Minimum Temperature, air cooled, ambient 20°C: 10 MHz -70ºC, 17 MHz•3 -70ºC
• Chiller Liquid Cooling, coolant @ 10°C, >0.75l/min: 10 MHz -80ºC, 17 MHz•3 -80ºC
• Thermostatic Precision: ± 0.01°C
• Triggering: Internal, External, External Start, External Exposure, Software Trigger
• System Window Type: UV-grade fused silica, Broadband Visible-Near Infrared, 0.5 degree wedge
• Digitization: 16-bit (at all speeds)
• PC Interface: USB 2.0
• Lens Mount: C-mount
• Dark Current and Background Events•4,5:
• Dark Current (e- /pixel/sec) @ -80°C: 0.00030
• Spurious Background (events/pix) @ 1000x gain / -80°C: 0.0018
• Active Area Pixel Well Depth: 180,000 e
• Gain Register Pixel Well Depth•6: 800, 000 e
• Read noise (e-) •7: <1
• Linearity•8: Better than 99.9%
• Vertical Clock Speed: 0.3 to 3.3 µs (user selectable)
• Timestamp accuracy: 10 ns

 

 

 

 

 

 

 

 

 

The highly innovative, megapixel, camera offers single photon sensitivity across a large field of view, at 26 fps. Building on a rich history of first to market innovation, the ‘supercharged’ iXon Ultra 888, represents a massive performance boost for the largest available EMCCD sensor, as well as the first USB 3.0 enabled EMCCD camera. The iXon Ultra 888 has been fundamentally re-engineered to facilitate a 3x acceleration of the pixel readout speed to an unprecedented 30 MHz, whilst maintaining quantitative stability, propelling the full frame performance to video rate. Designed to be the most flexible yet easy to use EMCCD on the market, optimizable for a wide variety of application requirements in a single click via the OptAcquire™ feature. Crucially, the iXon brand carries an outstanding reputation within the industry for quality and reliability, brandishing an unparalleled track record of minimal field failures.

Specifications:

 

• Sensor QE: Back-illuminated, standard AR coated with fringe suppression
• Active Pixels: 1024 x 1024
• Pixel Size: 13 x 13 μm
• Image Area: 13.3 x 13.3 mm with 100% Fill Factor
• Pixel Readout Rate:
• Minimum Temperature, air cooled, ambient 20°C: 10 MHz -80ºC, 30 MHz•3 -60ºC
• Chiller Liquid Cooling, coolant @ 10°C, >0.75l/min: 10 MHz -95ºC, 30 MHz•3 -75ºC
• Thermostatic Precision: ± 0.01°C
• Triggering: Internal, External, External Start, External Exposure, Software Trigger
• System Window Type:
• #BV and BVF: UV-grade fused silica, Broadband Visible-Near Infrared, 0.5 degree wedge
• UVB, #EX, EXF: UV-grade fused silica, Broadband Vacuum Ultraviolet-Near Infrared, 0.5 degree wedge
• Digitization: 16-bit (at all speeds)
• PC Interface: USB 3.0•12
• Lens Mount: C-mount
• Direct Data: Access Camera Link 3-tap output
• Dark Current and Background Events•4,5:
• Dark Current (e- /pixel/sec) @ -80°C: 0.00025
• Dark Current (e- /pixel/sec) @ max cooling: 0.00011
• Spurious Background (events/pix) @ 1000x gain / -85°C: 0.005
• Active Area Pixel Well Depth: 80,000 e-
• Gain Register Pixel Well Depth•76: 730,000 e-
• Linearity•8: Better than 99.9%
• Vertical Clock Speed: 0.6 to 4.33 µs (user selectable)
• Timestamp Accuracy: 10 ns

 

 

 

 

 

 

 

 

 

 

 

 

 

 

The highly innovative, megapixel, camera offers single photon sensitivity across a large field of view, at 26 fps. Building on a rich history of first to market innovation, the ‘supercharged’ iXon Ultra 888, represents a massive performance boost for the largest available EMCCD sensor, as well as the first USB 3.0 enabled EMCCD camera. The iXon Ultra 888 has been fundamentally re-engineered to facilitate a 3x acceleration of the pixel readout speed to an unprecedented 30 MHz, whilst maintaining quantitative stability, propelling the full frame performance to video rate. Designed to be the most flexible yet easy to use EMCCD on the market, optimizable for a wide variety of application requirements in a single click via the OptAcquire™ feature. Crucially, the iXon brand carries an outstanding reputation within the industry for quality and reliability, brandishing an unparalleled track record of minimal field failures.

Specifications:

 

• Sensor QE: Back-illuminated, EX2 dual AR coated
• Active Pixels: 1024 x 1024
• Pixel Size: 13 x 13 μm
• Image Area: 13.3 x 13.3 mm with 100% Fill Factor
• Pixel Readout Rate
• Minimum Temperature, air cooled, ambient 20°C: 10 MHz -80ºC, 30 MHz•3 -60ºC
• Chiller Liquid Cooling, coolant @ 10°C, >0.75l/min: 10 MHz -95ºC, 30 MHz•3 -75ºC
• Thermostatic Precision: ± 0.01°C
• Triggering: Internal, External, External Start, External Exposure, Software Trigger
• System Window Type:
• #BV and BVF: UV-grade fused silica, Broadband Visible-Near Infrared, 0.5 degree wedge
• UVB, #EX, EXF: UV-grade fused silica, Broadband Vacuum Ultraviolet-Near Infrared, 0.5 degree wedge
• Digitization: 16-bit (at all speeds)
• PC Interface: USB 3.0•12
• Lens Mount: C-mount
• Direct Data: Access Camera Link 3-tap output
• Dark Current and Background Events•4,5:
• Dark Current (e- /pixel/sec) @ -80°C: 0.00025
• Dark Current (e- /pixel/sec) @ max cooling: 0.00011
• Spurious Background (events/pix) @ 1000x gain / -85°C: 0.005
• Active Area Pixel Well Depth: 80,000 e-
• Gain Register Pixel Well Depth•76: 730,000 e-
• Linearity•8: Better than 99.9%
• Vertical Clock Speed: 0.6 to 4.33 µs (user selectable)
• Timestamp Accuracy: 10 ns

 

 

 

 

 

 

 

 

 

 

 

 

The highly innovative, megapixel, camera offers single photon sensitivity across a large field of view, at 26 fps. Building on a rich history of first to market innovation, the ‘supercharged’ iXon Ultra 888, represents a massive performance boost for the largest available EMCCD sensor, as well as the first USB 3.0 enabled EMCCD camera. The iXon Ultra 888 has been fundamentally re-engineered to facilitate a 3x acceleration of the pixel readout speed to an unprecedented 30 MHz, whilst maintaining quantitative stability, propelling the full frame performance to video rate. Designed to be the most flexible yet easy to use EMCCD on the market, optimizable for a wide variety of application requirements in a single click via the OptAcquire™ feature. Crucially, the iXon brand carries an outstanding reputation within the industry for quality and reliability, brandishing an unparalleled track record of minimal field failures.

Specifications:

 

• Sensor QE: Back-illuminated, EX2 dual AR coated with fringe suppression
• Active Pixels: 1024 x 1024
• Pixel Size: 13 x 13 μm
• Image Area: 13.3 x 13.3 mm with 100% Fill Factor
• Pixel Readout Rate:
• Minimum Temperature, air cooled, ambient 20°C: 10 MHz -80ºC, 30 MHz•3 -60ºC
• Chiller Liquid Cooling, coolant @ 10°C, >0.75l/min: 10 MHz -95ºC, 30 MHz•3 -75ºC
• Thermostatic Precision: ± 0.01°C
• Triggering: Internal, External, External Start, External Exposure, Software Trigger
• System Window Type:
• #BV and BVF: UV-grade fused silica, Broadband Visible-Near Infrared, 0.5 degree wedge
• UVB, #EX, EXF: UV-grade fused silica, Broadband Vacuum Ultraviolet-Near Infrared, 0.5 degree wedge
• Digitization: 16-bit (at all speeds)
• PC Interface: USB 3.0•12
• Lens Mount: C-mount
• Direct Data: Access Camera Link 3-tap output
• Dark Current and Background Events•4,5:
• Dark Current (e- /pixel/sec) @ -80°C: 0.00025
• Dark Current (e- /pixel/sec) @ max cooling: 0.00011
• Spurious Background (events/pix) @ 1000x gain / -85°C: 0.005
• Active Area Pixel Well Depth: 80,000 e-
• Gain Register Pixel Well Depth•76: 730,000 e-
• Linearity•8: Better than 99.9%
• Vertical Clock Speed: 0.6 to 4.33 µs (user selectable)
• Timestamp Accuracy: 10 ns